• Date : 2006
• Die Size : 5.0 x 5.0[mm^2]
• Process : Rohm 0.18um
• No. of PE : 4 x 4
• PE style : Heterogeneous
• Data Width : 24bit
• Context Size : 64
• Interconnect : Island style

• Date : 2007
• Die Size : 2.5 x 2.5[mm^2]
• Process : ASPLA 90um
• No. of PE : 4 x 4
• PE style : Homogeneous
• Data Width : 16bit
• Context Size : 16
• Interconnect : Island style

• Year : 2009
• Die size : 2.1×4.2[mm^2]
• Process : Fujitsu 65nm
• No. of PE : 4 x 4
• PE style : Homogeneous
• Data Width : 16bit
• Context Size : 32
• Interconnect : Hybrid style(Island & Direct)

2009年のICFPTにて，MuCCRA-3の実チップを用いてデモンストレーションを行いました． カメラからの画像をリアルタイムに処理し，FPGAに対して約10倍の電力効率を達成できます．

We have MuCCRA-3 real chip demonstrated in ICFPT 2009, 2010. In the demonstration, MuCCRA-3 processing image of captured from camera in real time. it achieved x10 power-efficiency compared with Xilinx's virtex-5 FPGA which using same process technology.

• Year : 2009
• Die size : 2.1×4.2[mm^2]
• Process : Fujitsu 65nm
• No. of PE : 4 x 4 x 4 (4 chip stacked)
• PE style : Homogeneous
• Data Width : 16bit
• Context Size : 32
• Interconnect : Hybrid style & Inductive Coupling

MuCCRA-Cube is a prototype chip for evaluation of chip-to-chip connection using inductive coupling. The result of evaluation, it can achieved over 4Gbps throughput without any bonding wires between chip and chip!